Specification
Cooler Master Thermal Pad 13.3W/mK ThermalPad Lembaran 95mm x 45mm

THERMAL PAD
Cooler Master's new Thermal Pad is an innovative solution to device cooling for a vast range of your electronic devices and components.

FORMULATED WITH NANO ELEMENTS
13.3w/mK thermal conductivity for rapid cooling, capable of drawing high levels of heat.

NON-TOXIC AND NON-CORROSIVE
Safe and simple formula with electrically insulated and heat resistant properties to prevent hardening.

DOUBLE-SIDED ADHESIVE
Provides seamless and secure contact between surfaces.

WIDE RANGE OF APPLICATION
Electronic devices, motherboards, components (CPU, GPU, USICS, Hard Drives, Disk Drives, IGBT module), laptops and various products requiring cooling.

VERSATILE AND EASY APPLICATION
Easily cut to the perfect size for your application. Multiple choices of thickness are available.

THICKNESS 0.5mm, 1.0mm, 1.5mm, 2.0mm, 3.0mm
WEIGHT 15g
PRODUCT NUMBER TPX-NOPP-9005-R1, TPX-NOPP-9010-R1, TPX-NOPP-9015-R1, TPX-NOPP-9020-R1, TPX-NOPP-9030-R1
DIMENSIONS (L X W X H) 95 X 45 MM
THERMAL CONDUCTIVITY 13.3 (W/M.K)
COLOR PURPLE
DENSITY 3.4 ± 0.2 G/CC
HARDNESS 30~60 SC
BREAKDOWN VOLTAGE 6KV (1MM)
WORKING TEMPERATURE -40 ~ 200°C
COOLER TYPE THERMAL GREASE